Application of Hot-wire Method for Measuring Thermal Conductivity of Fine Ceramics. [EN]

Authors of the publication: - SX Wang - D Zhang - GS Liu - WJ Wang - MX Hu

Ceramic substrate is preferred in high density packaging due to its high electrical resistivity and moderate expansion coefficient. The thermal conductivity is a key parameter for packaging substrates. There are two common methods to measure the thermal conductivity, which are the hot-wire method

Impact of Graphene or Reduced Graphene Oxide on Performance of Thermoelectric Composites. [EN]

Authors of the publication: - O Okhay - A Tkach

processes, and home heating is one possible way of enabling the transformation from a fossil fuel-based society to a low-carbon socioeconomic epoch. Thermoelectric (TE) generators can convert heat to electrical energy thanks to high-performance TE materials that work via Seebeck effects.