Application of Hot-wire Method for Measuring Thermal Conductivity of Fine Ceramics. [EN]

Authors of the publication: - SX Wang - D Zhang - GS Liu - WJ Wang - MX Hu

Ceramic substrate is preferred in high density packaging due to its high electrical resistivity and moderate expansion coefficient. The thermal conductivity is a key parameter for packaging substrates. There are two common methods to measure the thermal conductivity, which are the hot-wire method

Measurement of the thermal conductivity of liquids by hot wire method: comparison between transient and stationary approaches [EN]

Authors of the publication: Jean-Pierre MONCHAU (monchau@themacs.fr) - Nicolas Lalanne - Laurent Ibos

This work concerns the characterization of the thermal conductivity of liquids by hot wire method.